Evolution of the microstructure of Sn–Ag–Cu solder joints exposed to ultrasonic waves during solidification-Reference-Cited by-同舟云学术

Evolution of the microstructure of Sn–Ag–Cu solder joints exposed to ultrasonic waves during solidification

Author:

Chinnam R.K.,Fauteux C.,Neuenschwander J.,Janczak-Rusch J.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference27 articles.

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