An analysis of the indentation test to determine the interface toughness in a weakly bonded thin film coating – substrate system
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Stress-related effects in thin films
2. Overview of the solid-solid interface: Mechanical stability
3. Indentation-induced interface delamination of a strong film on a ductile substrate
4. Delamination of a strong film from a ductile substrate during indentation unloading
5. Numerical analysis of indentation-induced cracking of brittle coatings on ductile substrates
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