Overview of the solid-solid interface: Mechanical stability-Reference-Cited by-同舟云学术

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Overview of the solid-solid interface: Mechanical stability

Published:1982-04 Issue:1 Volume:53 Page:37-46
ISSN:0025-5416
Container-title:Materials Science and Engineering
language:en
Short-container-title:Materials Science and Engineering

Author:

Hoffman Richard W.

Publisher

Elsevier BV

Subject

General Engineering

Reference45 articles.

1. Thin films;Phys. Today, Spec. Issue,1980

2. Low Temperature Diffusion and Application to Thin Films,1975

3. Residual strains of Pb thin films deposited onto Si substrates

4. Proc. Workshop on Basic Research Needs and Opportunities on Interfaces in Solar Materials;Balluffi,1982

5. Applications of thin films in solar energy;J. Vac. Sci. Technol.,1980

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of thermal annealing on the mechanical properties of low-emissivity physical vapor deposited multilayer-coatings for architectural applications;Thin Solid Films;2012-10

2. Finite Element Analysis of the Indentation-Induced Delamination of Bi-Layer Structures;Journal of Computational and Theoretical Nanoscience;2012-06-01

3. An analysis of the indentation test to determine the interface toughness in a weakly bonded thin film coating – substrate system;Acta Materialia;2004-06

4. A new indentation cracking method for evaluating interfacial adhesion energy of hard films;Thin Solid Films;2003-09

5. Residual stresses and stress-induced cracks in coated components;Thin Solid Films;1995-11

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