From metallic glasses to nanocrystals: Molecular dynamics simulations on the crossover from glass-like to grain-boundary-mediated deformation behaviour
Author:
Funder
Deutsche Forschungsgemeinschaft
DFG
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference80 articles.
1. Untangling dislocation and grain boundary mediated plasticity in nanocrystalline nickel;Lohmiller;Acta Mater.,2014
2. Nanocrystalline materials;Gleiter;Prog. Mater. Sci.,1989
3. Mechanical properties of nanocrystalline materials;Meyers;Prog. Mater. Sci.,2006
4. Deformation of nanocrystalline materials by molecular-dynamics simulation: relationship to experiments?;Wolf;Acta Mater.,2005
5. The Hall–Petch breakdown in nanocrystalline metals: a crossover to glass-like deformation;Trelewicz;Acta Mater.,2007
Cited by 42 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mo content-dependent hardness and microstructural evolution of CoCrNiMox medium entropy alloys;Materials Today Communications;2024-08
2. Exceptional ductility through interface-constrained grain growth for the ultrafine-scale Ni/Ni-W layered composites;International Journal of Plasticity;2024-05
3. Annealing hardening/softening of nanocrystalline Ta films mediated by grain boundary evolution and phase transformation;Materials Science and Engineering: A;2024-03
4. Mobile dislocation mediated Hall-Petch and inverse Hall-Petch behaviors in nanocrystalline Al-doped boron carbide;Journal of the European Ceramic Society;2024-02
5. Phase Engineering of Nanostructural Metallic Materials: Classification, Structures, and Applications;Chemical Reviews;2024-01-23
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3