On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Author:

Attari VahidORCID,Ghosh SupriyoORCID,Duong ThienORCID,Arroyave RaymundoORCID

Funder

National Science Foundation under NSF

Army Research Laboratory

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

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