Nickel–copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

Author:

Lee Jong-Gun,Kim Do-Yeon,Kang Byungjun,Kim Donghwan,Song Hee-eun,Kim Jooyoung,Jung Woonsuk,Lee Dukhaeng,Al-Deyab Salem S.,James Scott C.,Yoon Sam S.

Funder

Ministry of Science, ICT & Future Planning

NRF

Industrial Strategic Technology Development Program

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference35 articles.

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3. Double screen printed metallization of crystalline silicon solar cells as low as 30μm metal line width for mass production;Ju;Sol. Energy Mater. Sol. Cells,2012

4. M.M. Hilali, A. Rohatgi, B. To. A review and understanding of screen-printed contacts and selective-emitter formation, in: 14th workshop on crystalline silicon solar cells and modules, vol. 1617, 2004, pp. 80401–83393.

5. Evaluating the large electromigration resistance of copper interconnects employing a newly developed accelerated life-test method;Nitta;J. Electrochem. Soc.,1993

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