Interface temperature evolution and bonding characteristics analysis induced by microparticle impact-Reference-Cited by-同舟云学术

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Interface temperature evolution and bonding characteristics analysis induced by microparticle impact

Published:2024-06 Issue: Volume:193 Page:104989
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Wang Wei,Wu Shufan,Mu Zhongcheng^ORCID,Yi Jiyuan^ORCID,Wang Zhicong^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference48 articles.

1. Analytical models for penetration mechanics: a review;Anderson;Int. J. Impact Eng.,2017

2. Bonding mechanism in cold gas spraying;Assadi;Acta Mater.,2003

3. Cold spraying–A materials perspective;Assadi;Acta Mater.,2016

4. Transdermal and transmucosal powdered drug delivery;Burkoth;Crit. Rev.™ Ther. Drug Carrier Syst.,1999

5. Los Alamos Series on Dynamic Material Properties;Data,1980

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