Additive-effects during plating in acid tin methanesulfonate electrolytes-Reference-Cited by-同舟云学术

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Additive-effects during plating in acid tin methanesulfonate electrolytes

Published:2004-10 Issue:25 Volume:49 Page:4303-4311
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Martyak Nicholas M,Seefeldt Robert

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference23 articles.

1. F. Lowenheim, Modern Electroplating, John Wiley and Sons, New York, NY, 1974.

2. M. Jordan, The Electrodeposition of Tin and its Alloys, Eugen Leuze, Saulgau, Germany, 1995.

3. J. Abys, K. Murski, Y. Zhang, US Patent 6,267,863 B1 (2001).

4. The suppression of tin, lead and tin-lead electrodeposition by organic compounds

5. The Electrodeposition of Tin and Its Alloys

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