In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate-Reference-Cited by-同舟云学术

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In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate

Published:2020-01 Issue: Volume:330 Page:135358
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Li Jiujuan,Zhou Guoyun,Hong Yan,He Wei,Wang Shouxu,Wang Chong,Chen Yuanming,Zhou Jinqun,Miao Hua,Weng Zesheng,Andersson Martin

Funder

National Natural Science Foundation of China

China Scholarship Council

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference55 articles.

1. Compact, flexible conducting polymer/graphene nanocomposites for supercapacitors of high volumetric energy density;Moussa;Compos. Sci. Technol.,2018

2. Thermal-air ageing treatment on mechanical, electrical, and electromagnetic interference shielding properties of lightweight carbon nanotube based polymer nanocomposites;Mondal;Compos. Appl. Sci. Manuf.,2018

3. Improved hybrid solar cells via in situ UV polymerization;Tepavcevic;Small,2009

4. Redox exchange induced MnO2 nanoparticle enrichment in poly(3,4-ethylenedioxythiophene) nanowires for electrochemical energy storage;Liu;ACS Nano,2010

5. Fabrication of flexible free-standing reduced graphene oxide/polyaniline nanocomposite film for all-solid-state flexible supercapacitor;Hu;Electrochim. Acta,2018

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1. Conductive polyaniline film synthesized through in-situ polymerization as a conductive seed layer for hole metallization of printed circuit boards;Applied Surface Science;2024-05

2. Study on copper interconnection structure of flexible electronics by Ag-PT composite membrane induced electrodeposition;Journal of Materials Science: Materials in Electronics;2023-02

3. Effect of Cu@polythiophene yolk–shell nanofiller on the electrical, mechanical and thermal properties of poly(vinyl alcohol) thin films;Polymer Bulletin;2022-01-31

4. Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns;Journal of the Taiwan Institute of Chemical Engineers;2021-06

5. Metallisation of Textiles and Protection of Conductive Layers: An Overview of Application Techniques;Sensors;2021-05-18

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