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Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns

  • Published:2021-06 Issue: Volume:123 Page:254-260
  • ISSN:1876-1070
  • Container-title:Journal of the Taiwan Institute of Chemical Engineers
  • language:en
  • Short-container-title:Journal of the Taiwan Institute of Chemical Engineers

Author:

Li Jiujuan,Hong Yan,Zhou Guoyun,Zhang Huaiwu,He Wei,Wang Shouxu,Chen Yuanming,Wang Chong,Su Xinhong,Sun Yukai,Andersson Martin

Funder

National Natural Science Foundation of China

Science and Technology Planning Project of Guangdong Province

Publisher

Elsevier BV

Subject

General Chemical Engineering,General Chemistry

Reference43 articles.

1. Advantages and challenges of 10-gbps transmission on high-density interconnect boards;Yee;J Electron Mater,2016

2. High density interconnect microstrip patch antenna for 5G base stations with integrated filtering performance;Salucci;Technologies,2018

3. PCB-package to chip wireless power transfer scheme using magnetic-field resonance coupling for high-density 3-D IC;Jinwook Song,2016

4. Materials and designs for wearable photodetectors;Cai;Adv Mater,2019

5. Flexible electronics based on micro/nanostructured paper;Zhang;Adv Mater,2018

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