Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique-Reference-Cited by-同舟云学术

Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique

Published:2010-04 Issue:12 Volume:55 Page:3870-3875
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Pecequilo Cristiane Vargas,Panossian Zehbour

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference28 articles.

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4. Modern Electroplating;Lowenheim,1974

5. G.A. Kline, Cyanide-free copper plating process, US Patent Office 4,933,051 (June) (1990) 6 p.

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