Copper electrodeposition onto the dendrimer-modified native oxide of silicon substrates
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference20 articles.
1. Damascene copper electroplating for chip interconnections
2. Copper Electrodeposition: Principles and Recent Progress
3. Formation and stability of silicides on polycrystalline silicon
4. Electroless Metallization of Dendrimer-Coated Micropatterns
5. Spatially Selective Electroless Deposition of Cobalt on Oxide Surfaces Directed by Microcontact Printing of Dendrimers
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Role of Tellurium Ions for Electrochemically Synthesized Zinc Telluride 2D Structures on Nonconductive Substrate;Advanced Materials Interfaces;2023-03-03
2. Molecular Langmuir–Blodgett Film for Silicon Anode Interface Engineering;ACS Applied Energy Materials;2022-09-07
3. Electrodeposition as an Alternative Approach for Monolithic Integration of InSb on Silicon;Frontiers in Chemistry;2022-01-20
4. Photoelectrocatalytic H2 evolution enhancement over CuO-decorated TiO2 nanocatalysts and promoting E. coli degradation;Journal of Alloys and Compounds;2021-04
5. ALD Pt nanoparticles and thin-film coatings enhancing the stability and performance of silicon photocathodes for solar water splitting;Sustainable Energy & Fuels;2021
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3