Electrochemical deposition of copper and ruthenium on titanium-Reference-Cited by-同舟云学术

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Electrochemical deposition of copper and ruthenium on titanium

Published:2006-07 Issue:25 Volume:51 Page:5445-5451
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Kim Young-Soon,Kim Hyung-Il,Cho Joong-Hee,Seo Hyung-Kee,Kim Gil-Sung,Ansari S.G.,Khang Gilson,Senkevich Jay J.,Shin Hyung-Shik

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference24 articles.

1. Damascene copper electroplating for chip interconnections

2. New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects

3. Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

4. Electrodeposition of Copper Thin Film on Ruthenium

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ruthenium electrodeposition from non-aqueous electrolytes containing divalent ions;Electrochimica Acta;2023-11

2. Enhancing long-term cyclic oxidation performance of a dual-phase PtAl coatings at 1200 ℃ by Ru modification;Corrosion Science;2023-09

3. β-Cyclodextrin and graphene oxide co-strengthened AgRu bimetal mesoporous nanozyme: An efficient strategy for visual detection and removal of toxic Hg2+ and Cl−;Journal of Environmental Chemical Engineering;2022-10

4. Analysis of Ruthenium Electrodeposition in the Nitric Acid Medium;The Journal of Physical Chemistry C;2022-02-23

5. Electrodeposition of Ru onto Ru and Au Seed Layers from Solutions of Ruthenium Nitrosyl Sulfate and Ruthenium Chloride;Journal of The Electrochemical Society;2021-05-01

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