Abstract
The electrodeposition of Ru was investigated from solutions of ruthenium(III) nitrosyl sulfate and ruthenium(III) chloride onto seed layers of epitaxial and polycrystalline Ru and epitaxial Au. Using both galvanostatic and potentiostatic deposition modes, metallic Ru was found to electrodeposit as a porous layer comprised of (0001) oriented Ru crystallites, the presence of which was discovered and confirmed by X-ray and scanning transmission and transmission electron microscope (S/TEM) analyses. This finding was independent of the Ru salt and seed layer used. Using X-ray reflectivity (XRR), the average film density
ρ
e
f
f
of the porous electrodeposited Ru layer was measured as less than the density of bulk Ru
ρ
R
u
,
b
u
l
k
(14.414 g cm−3). Increasing the magnitude of the applied current density from −100 μA cm−2 to −10 mA cm−2 in solutions of Ru nitrosyl sulfate increased the
ρ
e
f
f
from 7.4 g cm−3 to 9.7 g cm−2 while the current efficiency decreased from 9.4% to 4.3%.
Funder
Division of Electrical, Communications and Cyber Systems
Air Force Office of Scientific Research
Semiconductor Research Corporation
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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