Electrodeposition of copper on glassy carbon electrodes in the presence of picolinic acid-Reference-Cited by-同舟云学术

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Electrodeposition of copper on glassy carbon electrodes in the presence of picolinic acid

Published:2013-12 Issue: Volume:113 Page:706-718
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Bolzán A.E.

Funder

Agencia Nacional de Promoción Científica y Tecnológica of Argentina

Consejo Nacional de Inves tigaciones Científicas y Técnicas

Comisión de Investigaciones Científicas de la Provincia de Buenos Aires

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference43 articles.

1. Industrial Electrochemistry;Pletcher,1990

2. The chemistry of additives in damascene copper plating;Vereecken;IBM J. Res. & Dev.,2005

3. Effects of additives on copper electrodeposition in submicrometer trenches;Hasegawa;J. Electrochem. Soc.,2005

4. Nucleation and growth of copper under combined charge transfer and diffusion limitations. Part I;Milchev;Electrochim. Acta,2006

5. The chemistry of the additives in an acid copper electroplating bath. Part I. Polyethylene glycol and chloride ion;Healy;J. Electroanal. Chem.,1992

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