Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference20 articles.
1. Damascene copper electroplating for chip interconnections
2. Superconformal Electrodeposition of Copper in 500–90 nm Features
3. A Superfilling Model that Predicts Bump Formation
4. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition
5. ULSI Wiring Formation by Copper Electroplating in the Presence of Additives
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2. Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches;Surface Engineering and Applied Electrochemistry;2023-02
3. Synthesis of carbon-based Ag-Pd bimetallic nanocomposite and the application in electroless copper deposition;Electrochimica Acta;2023-01
4. Research Progress of Electroless Plating Technology in Chip Manufacturing;Acta Chimica Sinica;2022
5. Effect of the functional group of polyethylene glycol on the characteristics of copper pillars obtained by electroplating;Journal of Materials Science: Materials in Electronics;2021-04-30
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