Reaction and nucleation mechanisms of copper electrodeposition on disposable pencil graphite electrode
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference71 articles.
1. Modern Electroplating;Dini,2000
2. Damascene copper electroplating for chip interconnections
Cited by 74 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of nitrogen-containing groups on the reduction of copper ions: In situ Raman and AIMD;Surfaces and Interfaces;2024-08
2. High-speed electrolyte jet 3D printing of ultrasmooth and robust Cu microelectrodes;Journal of Materials Science;2024-03
3. Application of Electrochemical Impedance Spectroscopy (EIS) to Study the Effect of Temperature and Ion Concentration During Electroplating of Copper from an Acidic Bath;Transactions of the Indian Institute of Metals;2023-12-20
4. Electrodeposition of nanostructured copper oxide (CuO) coatings as spectrally solar selective absorber: Structural, optical and electrical properties;Infrared Physics & Technology;2023-09
5. Research progress of additives for electroplating copper in high-end electronic manufacturing;SCIENTIA SINICA Chimica;2023-09-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3