Funder
National Natural Science Foundation of China
Subject
Electrochemistry,General Chemical Engineering
Reference40 articles.
1. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications;Li;Mater. Sci. Eng.,2006
2. A review on epoxy-based electrically conductive adhesives;Aradhana;Int. J. Adhes. Adhes.,2020
3. Preparation of highly conductive silver nanowires for electrically conductive adhesives;Lu;J. Mater. Sci.,2019
4. Conducting polymer-based electrically conductive adhesive materials: design, fabrication, properties, and applications;Derakhshankhah;J. Mater. Sci.,2020
5. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging;Yim;J. Adhes. Sci. Technol.,2008