Microstructure and corrosion behavior of Si3N4/316L joints brazed with Ag-Cu/Ag/Mo/Ag/Ag-Cu-Ti multilayer filler
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference40 articles.
1. Potential application of ceramic matrix composites to aero-engine components;Ohnabe;Compos. Part A: Appl. Sci. Manuf.,1999
2. Effects of residual stress on fracture strength of Si3N4/stainless steel joints with a Cu-interlayer;Chang;J. Mater. Eng. Perform.,2002
3. Microstructure of brazed joints between mechanically metallized Si3N4 and stainless steel;Nascimento;J. Mater. Sci.,2005
4. Microstructure and brazing mechanism of porous Si3N4/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler;Zhang;J. Mater. Sci. Technol.,2018
5. Microstructural evolution of Si3N4/Ti6Al4V joints brazed with nano-Si3N4 reinforced AgCuTi composite filler;Zhao;Vacuum,2017
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