Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution-Reference-Cited by-同舟云学术

Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution

Published:2022-09 Issue: Volume:425 Page:140710
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Huang J.H.,Shih P.S.,Renganathan V.,Grӓfner S.J.,Chen Y.A.,Huang C.H.,Kao C.L.,Lin Y.S.,Hung Y.C.,Kao C.R.^ORCID

Funder

Ministry of Education

Ministry of Science and Technology, Taiwan

Advanced Research Center for Green Materials Science and Technology, National Taiwan University

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference44 articles.

1. Electroless plating: the past is prologue, Plating and surface finishing;Hajdu;(USA),1996

2. Parametric optimization of electroless Ni-P coating for impact resistance - a Taguchi approach;Kundu;Int. J. Manuf. Mater. Mech. Eng.,2014

3. Optimization of electroless Ni-Co-P coating with hardness as response parameter: a computational approach;Sarkar;J. Tribol.,2018

4. 30 years of electroless plating for semiconductor and polymer micro-systems;Shacham-Diamand;Microelectron. Eng.,2015

5. Highly uniform microfluidic electroless interconnections for chip stacking applications;Hung;Electrochim. Acta,2021

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