Electrochemical aspects of copper chemical mechanical planarization (CMP) in peroxide based slurries containing BTA and glycine
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference25 articles.
1. Chemical mechanical polishing of copper for multilevel metallization
2. Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
3. Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing
4. Modification of the Preston equation for the chemical–mechanical polishing of copper
5. Surface Chemistry Studies of Copper Chemical Mechanical Planarization
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