A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core-Reference-Cited by-同舟云学术

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A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core

Published:2019-11 Issue: Volume:489 Page:165363
ISSN:0304-8853
Container-title:Journal of Magnetism and Magnetic Materials
language:en
Short-container-title:Journal of Magnetism and Magnetic Materials

Author:

Zhou Guoyun,Zhang Weihao,He Di,Li Xiaoxuan,Wang Shouxu,Hong Yan,Chen Yuanming,Wang Chong,He Wei,Miao Hua,Zhou Jinqun

Publisher

Elsevier BV

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Development and application of Fe-based soft magnetic bulk metallic glassy inductors;Inoue;J. Alloys Compd.,2018

2. B. Wu, T. Mo. Passive equalizer design on high density interconnects for 25Gbps high speed IO and beyond, in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on, IEEE, Chengdu, China, Aug. 2014, pp. 39–42. doi: 10.1109/ICEPT.2014.6922580.

3. A novel silicon-embedded toroidal power inductor with magnetic core;Fang;Electron Device Lett.,2013

4. Analysis of integrated solenoid inductor with closed magnetic core;Wright;IEEE Trans. Magn.,2010

5. Magnetic thin film inductors for integrated circuit applications;Soohoo;IEEE Trans. Magn.,1979

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improved wear and corrosion protection of Ni–P alloy coating by an electrodeposited Ni–Co–P alloy coating;International Journal of Electrochemical Science;2024-09

2. Identification and classification of metal copper based on laser-induced breakdown spectroscopy;Journal of Laser Applications;2023-07-20

3. The influences of current density on chemical composition and magnetic properties of FeNix film prepared by electrodeposition;Journal of Materials Science: Materials in Electronics;2023-02

4. Embedded Magnetic Solenoid Inductor Into Organic Packaging Substrate Using Lithographic Via Technology for Power Supply Module Integration;IEEE Transactions on Electron Devices;2022-09

5. Additive-assisted cobalt electrodeposition as surface magnetic coating to enhance the inductance of spiral copper inductors;Surfaces and Interfaces;2022-02

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