Author:
Zhang Yin,Yao Liang,Chen Lingling
Funder
Department of Scientific and Industrial Research, Ministry of Science and Technology, India
Anhui University of Science and Technology
Anhui University of Technology
Reference43 articles.
1. Electrodeposition of nanocrystalline nickel—a brief review;Shriram;Int. J. Surf. Eng. Coat.,2000
2. Strengths and advantages of electrodeposition as a semiconductor growth technique for applications in macroelectronic devices;Dharmadasa;J. Electrochem. Soc.,2006
3. Effect of Cu immersion pretreatment on the structure and performance of electroless Ni-P on Al alloys, China;Kang;Surf. Eng.,2016
4. Microbial fouling characteristics of slime-forming bacteria on the surface of electroless plating of Ni-P;Wu;Chem. Ind. Eng. Prog.,2015
5. Electrodeposition of Ni-P composite coatings: a review;Lelevic;Surf. Coat. Technol.,2019