Author:
Ko Hyoungho,Park Sangjun,Choi Byoungdoo,Lee Ahra,“Dan” Cho Dong-il
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. The next generation integrated MEMS and CMOS process on SOI wafers for overdamped accelerometers;Chen,2005
2. A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology;Su;Sens. J. IEEE,2005
3. Sub-micro-gravity capacitive SOI microaccelerometers;Amini,2005
4. A high yield rate MEMS gyroscope with a packaged SiOG process;Lee;J. Mircomech. Microeng.,2005
5. Robust SOI process without footing and its application to ultra high-performance microgyroscopes;Kim;Sens. Actuators A,2004
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献