Etch-stop characteristics of heavily B/Ge-doped silicon epilayer in KOH and TMAH-Reference-Cited by-同舟云学术

Etch-stop characteristics of heavily B/Ge-doped silicon epilayer in KOH and TMAH

Published:2005-09 Issue: Volume:123-124 Page:640-645
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Tatic-Lucic Svetlana,Zhang Wen-Yue,Navneet Navneet

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Etch stop techniques for micromachining;Collins;J. Electrochem. Soc.,1997

2. Anisotropic etching of crystalline silicon in alkaline solution;Seidel;J. Electrochem. Soc.,1990

3. Etch rates for micromachining processing;Williams;J. MicroElectromech. Syst.,1996

4. Fundamentals of Microfabrication: the Science of Miniaturization;Madou,2001

5. Semiconductor Wafer Bonding: Science and Technology;Tong,1998

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