Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators

Author:

Belsito LucaORCID,Ferri Matteo,Mancarella Fulvio,Masini Luca,Yan Jize,Seshia Ashwin A.,Soga Kenichi,Roncaglia Alberto

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging;Belsito,2013

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3. Biomechanical evaluation of a simulated Bankart lesion;Speer;J. Bone Joint Surg. Am.,1994

4. The application of computational and experimental-techniques to metal deformation in cold roll forming;Senanayake;J. Mater. Process. Tech.,1994

5. Temperature and strain effect on electrical-resistivity of transition-metal alloys—application to strain-gauges;Brauwers;J. Phys. F Met. Phys.,1976

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