Author:
Zhang Ruihao,Qu Jiasheng,Cao Yingchao,Zhang Xinchao,Jia Yilong,Wang Xiaoyi,Zhou Wenbiao,Xie Huikai
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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1. Through-Silicon Isolation Based on Dry Filling and Reflow of Micron Glass Powders;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21