A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach-Reference-Cited by-同舟云学术

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

Published:2009-01 Issue:1 Volume:149 Page:165-171
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Chen Lung-Tai,Cheng Wood-Hi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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4. Analytical techniques for examining reliability and failure mechanisms of barrier coated encapsulated silicon pressure sensors exposed to harsh media;Bitko,1996

5. Finite element simulation of package stress in transfer molded MEMS pressure sensors;Krondorfer;Microelectronics Reliability,2004

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