Piezoelectric-on-silicon Lorentz force magnetometers based on radial contour mode disk resonators-Reference-Cited by-同舟云学术

Piezoelectric-on-silicon Lorentz force magnetometers based on radial contour mode disk resonators

Published:2018-10 Issue: Volume:281 Page:185-195
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Ghosh S.,Lee J. E.-Y.

Funder

Research Grants Council of Hong Kong

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. A CMOS-compatible 2-D vertical hall magnetic-field sensor using active carrier confinement and post-process micromachining;Paranjape;Sens. Actuators A Phys.,1996

2. Trench-hall devices;Vanha;J. Microelectromech. Syst.,2000

3. Applications of magnetoresistive sensors in navigation systems;Caruso;SAE-Publ.,1997

4. Three-axis Lorentz-force magnetic field sensor for electronic compass applications;Li;J. Microelectromech. Syst.,2012

5. Z-axis magnetometers for MEMS inertial measurement units using an industrial process;Langfelder;IEEE Trans. Ind. Electron.,2013

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Selective actuation of higher-order modes of an electromagnetically driven micro drum;Sensors and Actuators A: Physical;2024-12

2. Single-structure 3-axis Lorentz force magnetometer based on an AlN-on-Si MEMS resonator;Microsystems & Nanoengineering;2024-05-09

3. A ScAlN-based piezoelectric breathing mode dual-ring resonator with high temperature stability;Microelectronic Engineering;2024-04

4. Analysis and experimental verification of dual frequency ultrasonic transducer with contour and thickness vibration modes;Applied Acoustics;2022-03

5. Piezoelectric MEMS—evolution from sensing technology to diversified applications in the 5G/Internet of Things (IoT) era;Journal of Micromechanics and Microengineering;2021-12-03