A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force-Reference-Cited by-同舟云学术

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A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force

Published:2014-08 Issue: Volume:215 Page:1-7
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Beker Levent,Zorlu Özge,Külah Haluk

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Thin wafer handling – study of temporary wafer bonding materials and processes;Hermanowski,2009

2. Advanced MEMS Packaging (Electronic Engineering);Lau,2009

3. Integration of a temporary carrier in a TSV process flow;Charbonnier,2009

4. Low temperature full wafer adhesive bonding of structured wafers;Niklaus;Sens. Actuators A, Phys.,2001

5. Wafer Bonding with BCB and SU-8 for MEMS Packaging;Wiemer,2006

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An easy fabrication process of fully-sealed parylene microfluidic channels with a single deposition step;Microsystem Technologies;2016-03-26

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