Author:
Torunbalci Mustafa Mert,Alper Said Emre,Akin Tayfun
Funder
State Planning Organization
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference24 articles.
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4. A low temperature thin film electroplated metal vacuum package;Stark;J. Microelectromech. Syst.,2004
5. A method for wafer scale encapsulation of large lateral deflection MEMS devices;Graham;J. Microelectromech. Syst.,2010
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