Author:
Zhang Zongyang,Jin Min,Liu Sheng
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Changes in thick-film resistor values due to substrate flexure;Holmes;Microelectron. Reliab.,1973
2. Material compatibility and processing relationships for copper thick film hybrids, part I;Pitkanen;Int. J. Hybrid Microelectron.,1979
3. Copper materials system: a state-of-the-art perspective for the 1980;Needes,1981
4. Characteristics of thick film resistors embedded in low temperature co-fired ceramic (LTCC) substrates;Hsi;J. Eur. Ceram. Soc.,2007
5. Thick-film resistors on zirconia substrates for possible strain gauge applications;Hrovat;J. Eur. Ceram. Soc.,2003
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