Comparison of the Young’s modulus of polysilicon film by tensile testing and nanoindentation-Reference-Cited by-同舟云学术

Comparison of the Young’s modulus of polysilicon film by tensile testing and nanoindentation

Published:2005-01 Issue:1 Volume:117 Page:151-158
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Oh Chung-Seog,Lee Hak-Joo,Ko Soon-Gyu,Kim Shin-Woo,Ahn Hyun-Gyun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference13 articles.

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2. D.J. Chang, W.N. Sharpe Jr., Microengineering for Aerospace Systems, The Aerospace Press of The Aerospace Corporation, 1999, pp. 73–118.

3. W.N. Sharpe Jr., K. Jackson, G. Coles, M.A. Eby, R.L. Edwards, Mechanical Properties of Structural Thin Films, STP 1413, American Society of Testing and Materials, Orlando, 2001, pp. 229–247.

4. Microelectromechanical structures for materials research;Sharpe;Mat. Res. Society,1998

5. Materials issues in mircoelectromechanical systems (MEMS);Spearing;Acta Mater,2000

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