Characterization of anisotropic wet etching of Gallium Nitride for surface orientations of the <0001> crystallographic zone in H3PO4 etchant

Author:

Chen Y.,Xing Y.,Gong J.T.,Li Qi,Guo X.

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. Gallium nitride-based complementary logic integrated circuits;Zheng;Nat. Electron.,2021

2. Gallium Nitride–based photodiode: a review;Jabbar;Mater. Today.: Proc.,2021

3. A review of gallium nitride power device and its applications in motor drive;Ding;CES Trans. Electr. Mach. Syst.,2019

4. The interplay between damage- and chemical-induced isolation mechanism in Fe+-implanted AlGaN/GaN HEMT structures;Karolina;Mater. Sci. Semicond. Process.,2021

5. Gallium-nitride semiconductor technology and its practical design challenges in power electronics applications: an overview;Dalla Vecchia;Energies,2019

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1. Vertical GaN Trench‐MOSFETs Fabricated on Ammonothermally Grown Bulk GaN Substrates;physica status solidi (a);2024-06-02

2. CCA Simulation Approach for the Fabrication of Micro Spoke Structures by Wet Etching Process on GaN Substrate;2023 IEEE 7th Information Technology and Mechatronics Engineering Conference (ITOEC);2023-09-15

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