Author:
Niklaus Frank,Decharat Adit,Forsberg Fredrik,Roxhed Niclas,Lapisa Martin,Populin Michael,Zimmer Fabian,Lemm Jörn,Stemme Göran
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Low temperature full wafer adhesive bonding;Niklaus;Journal of Micromechanics and Microengineering,2001
2. 3D MEMS fabrication using low-temperature wafer bonding with benzocyclobutene (BCB);Chou,2001
3. Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays;Niklaus;Journal of Micromechanics and Microengineering,2001
4. Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding;Niklaus;IEEE Journal of Microelectromechanical Systems,2003
5. A wafer-level 3D IC technology platform;Gutmann,2003
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