A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications-Reference-Cited by-同舟云学术

A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications

Published:2008-10 Issue:2 Volume:147 Page:677-682
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Seok S.,Rolland N.,Rolland P.-A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. A study on wafer-level vacuum packaging for MEMS devices;Lee;J. Micromech. Microeng.,2003

2. Sealing of adhesive bonded devices on wafer level;Oberhammer;Sens. Actuator A: Phys.,2004

3. Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices;Jourdain;J. Micromech. Microeng.,2005

4. Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer;Kim;J. Micromech. Microeng.,2006

5. Processibility and electrical characteristics of glass substrates for RF wafer-level chip-scale packages;Polyakov,2003

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