Die separation and packaging of a surface micromachined piezoresistive pressure sensor-Reference-Cited by-同舟云学术

Die separation and packaging of a surface micromachined piezoresistive pressure sensor

Published:2007-02 Issue:2 Volume:133 Page:457-466
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Clausen Ingelin,Sveen Ola

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. MEMS-based permanently implanted brain pressure measurement system;Clausen,2004

2. Advanced hybrid integrated low-power telemetric pressure monitoring system for biomedical applications;Eggers,2000

3. Low power integrated pressure sensor system for medical applications;Hierold;Sens. Actuators A: Phys.,1999

4. FISO, “FOP-MIV Pressure Sensor,” Technologies Fiber Optic Sensors Inc. http://www.globalspec.com/FeaturedProducts/Detail/FISOTechnologies/FOPMIV_Pressure_Sensor/3215/1.

5. I. Godovitsyn, SMC Technological Centre. MSIEE 103498, Moscow, K-498, Russia, 2005, Personal communication.

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging;Microsystems & Nanoengineering;2023-12-19

2. Temperature Compensation and Pressure Bias Estimation for Piezoresistive Pressure Sensor Based on Machine Learning Approach;IEEE Transactions on Instrumentation and Measurement;2021

3. A chip-level oven-controlled system used to improve accuracy of silicon piezoresistive pressure sensor;Measurement;2019-09

4. Performance analysis of embossed diaphragm based MEMS piezo resistive pressure sensor for flood level measurement;Materials Today: Proceedings;2018

5. Performance Analysis of Sculptured Diaphragm for Low Pressure MEMS Sensors;Applied Mechanics and Materials;2014-07