Low power integrated pressure sensor system for medical applications

Author:

Hierold C,Clasbrummel B,Behrend D,Scheiter T,Steger M,Oppermann K,Kapels H,Landgraf E,Wenzel D,Etzrodt D

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. K. Abraham-Fuchs, W. Gumbrecht, C. Hierold, A. Steckenborn, Multiparameter Sensor Microsystems—from Research Towards a Mass Product? Sensor '97 Int. Congress, Nürnberg, May 13–15, 1997.

2. Full integration of a pressure-sensor system into a standard BiCMOS process;Scheiter;Sensors and Actuators A,1998

3. D. Dudenbostel, K.-L. Krieger, C. Candler, R. Laur, A New Passive CMOS Telemetry Chip to Receive Power and Transmit Data for a Wide Range of Sensor Applications, 1997 Int. Conf. On Solid-State Sensors and Actuators, TRANSDUCERS '97, Chicago, June 16–19, 1997, Digest of Technical Papers, Vol. 2, pp. 995–998.

4. J. Zacheja, B. Clasbrummel, J. Binder, U. Steinau, Implantable Telemetric Endosystem for Minimal Invasive Pressure Measurements, MedTech95, Berlin, Germany, (1995).

5. R. Kersjes, W. Mokwa, Compatible CMOS microsystems for automotive and for medical applications. In: K. Chau, R.M. Roop (Eds.), Micromachined Devices and Components II, 14–15.10.1996, Austin, TX, Proc. SPIE—The International Society for Optical Engineering, Vol. 2882, pp. 37–48.

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