Author:
Radwan S.I.,Shehata M.M.,El-Khabeary H.,Helal A.G.
Reference25 articles.
1. Ion solid surface interactions in ionized copper physical vapor deposition
2. Triggers for RF breakdown
3. Sputtering Deposition: Physics and Technology;Moshfegh,2009
4. Dai. Y., Liao. W., Chen. S., Zhou. L., Xie. X. Proc. SPIE, 7655(2-3), 76550X (2010).
5. Ion–assisted sputter deposition
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献