Author:
Gao Zhaoqing,Sun Hao,Cao Jinwei,Wang Chen,Hussain Muhammad Muzammal,Xiao Chengyu,Chen Yinbo,Dong Chong,Wang Yunpeng,Ma Haitao
Funder
National Natural Science Foundation of China
Central Universities
Shanghai Synchrotron Radiation Facility
Subject
Condensed Matter Physics,General Materials Science
Reference27 articles.
1. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment;European Commission;Off. J. Eur. Communities L.,2003
2. Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys;Osório;J. Alloys Compd.,2013
3. On the mechanism of the binary Cu/Sn solder reaction;Görlich;Appl. Phys. Lett.,2005
4. Effect of 0.5 wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization;Alam;J. Appl. Phys.,2003
5. Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders;Huang;Appl. Phys. Lett.,2005
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献