Fabrication of copper foil using cuprous sulfide superionic conductor under electric field-Reference-Cited by-同舟云学术

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Fabrication of copper foil using cuprous sulfide superionic conductor under electric field

Published:2022-08 Issue: Volume:287 Page:126246
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Xiang Siqi^ORCID,Yi Kun,Liang Yihan,Zhang Xinfang

Funder

National Natural Science Foundation of China

Recruitment Program of Global Experts

National Key Research and Development Program of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference33 articles.

1. Mechanical fatigue of thin copper foil;Merchant;J. Electron. Mater.,1999

2. Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry;Luo;J. Adhes. Sci. Technol.,2018

3. Printed circuit board recycling: a patent review;Rocchetti;J. Clean. Prod.,2018

4. Role of a printed circuit board copper clad current collector in supercapacitor application;Pilathottathil;J. Electron. Mater.,2019

5. A reflection on lithium-ion battery cathode chemistry;Manthiram;Nat. Commun.,2020

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