Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry-Reference-Cited by-同舟云学术

Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry

Published:2018-01-09 Issue:13 Volume:32 Page:1452-1470
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Luo Li¹,Zhang Shengtao¹,Qiang Yujie¹,Bozdag Ismail²,Chen Shijin³,Tang Mingxing¹,Gao Jingyao⁴,Qin Zhongjian¹

Affiliation:

1. School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, P.R. China

2. Institue of Education, University College London, London, UK

3. Research and Development Department, Guangdong Bomin Sci-Tech Co., Ltd., Meizhou, P.R. China

4. State Key Lab of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China (UESTC), Chengdu, P.R. China

Funder

Sail plan of Guangdong, China

Natural Science Foundation of China

Opening Project of Material Corrosion and Protection Key Laboratory of Sichuan Province

key technology and industrialization for high density intelligently control circuits of automotive electronics

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2017.1423159

Reference53 articles.

1. Aminealkylthiol and dithiol self-assembly as adhesion promoter between copper substrate and epoxy resin

2. Adhesion improvement of graphene/copper interface using UV/ozone treatments

3. Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

4. Interfacial toughness measurements for thin films on substrates

5. Adhesion and Adhesives

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