Effect of nitrogen addition on the morphology, magnetic and magnetoresistance properties of electrodeposited Co, Ni and Co–Ni granular thin films onto aluminum substrates
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference49 articles.
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2. Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate;Journal of Adhesion Science and Technology;2018-11-19
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4. SEM, XPS Studies, and Magnetoresistance Properties of Co, Ni, Co–N, and Ni–N Thin Films Prepared by Electrodeposition;Journal of Superconductivity and Novel Magnetism;2015-11-16
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