Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate-Reference-Cited by-同舟云学术

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Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate

Published:2018-11-19 Issue:3 Volume:33 Page:301-313
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Zhao Zhong¹,Zhu Pengcheng¹,Yang Linchu¹,Geng Yaoxiang²

Affiliation:

1. School of Mechanical Engineering, Jiangsu University of Science and Technology, Zhenjiang, People’s Republic of China;

2. School of Materials Science and Engineering, JiangSu University of Science and Technology, Zhenjiang, People’s Republic of China

Funder

Natural Science Foundation of Jiangsu Province

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/01694243.2018.1539150

Reference39 articles.

1. Manufacturing methods and applications of membranes in microfluidics

2. Successful transdermal allergen delivery and allergen-specific immunotherapy using biodegradable microneedle patches

3. Hybrid localized surface plasmon resonance and quartz crystal microbalance sensor for label free biosensing

4. Deposition, Characterization and Evaluation of Monolayer and Multilayer Ni, Ni–P and Ni–P–Nano ZnOp Coatings

5. Effect of alumina content on surface morphology and hardness of Ni-P-Al2O3(α) electroless composite coatings

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1. Improving the wear resistance of the magnesium alloy WE43 by cold sprayed Ni–Al₂O₃ and Ni–Zn–Al₂O₃ coatings;Materials Testing;2023-06-01

2. Solving the Bonding Problem of the Ni Thin Coating with the Ultrasonic Assisted Electrochemical Potential Activation Method;Micromachines;2022-12-23

3. Corrosion behavior of the nickel/nickel interface during the copper‐sacrificial layer release process in micro‐electroforming;Materials and Corrosion;2022-01-20

4. To reduce the passivation layer of Cu substrate by the ultrasonic assisted electrochemical potential activation method;Micro & Nano Letters;2021-11-10

5. A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate;Journal of Adhesion Science and Technology;2021-01-11

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