Comparison of oxidation resistance of copper treated by beam-line ion implantation and plasma immersion ion implantation
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference17 articles.
1. Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions
2. Native oxidation of ultra high purity Cu bulk and thin films
3. Antibacterial properties and corrosion resistance of Cu and Ag/Cu porous materials
4. Oxidation and protection in copper and copper alloy thin films
5. Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion
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2. Formation of thin oxide layer on surface of copper caused by implantation of high-energy oxygen ions;Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques;2017-01
3. Deposition of silver films on copper nanopowders by three-times electroless plating;Journal of Materials Science: Materials in Electronics;2016-09-21
4. Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu;Transactions of Nonferrous Metals Society of China;2015-06
5. High temperature oxidation resistance and microstructure change of aluminized coating on copper substrate;Transactions of Nonferrous Metals Society of China;2015-01
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