Native oxidation of ultra high purity Cu bulk and thin films-Reference-Cited by-同舟云学术

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Native oxidation of ultra high purity Cu bulk and thin films

Published:2006-12 Issue:5 Volume:253 Page:2825-2829
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Iijima J.,Lim J.-W.,Hong S.-H.,Suzuki S.,Mimura K.,Isshiki M.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference25 articles.

1. A copper/polyimide Metal-base packaging technology

2. Native Oxide Layers Formed on the Surface of Ultra High-Purity Iron and Copper Investigated by Angle Resolved XPS

3. Oxidation Mechanism of Copper at 623-1073 K

4. A study of the initial oxidation of copper in 0.1 MPa oxygen and the effect of purity by metallographic methods

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