Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent-Reference-Cited by-同舟云学术

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Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent

Published:2019-06 Issue: Volume:232 Page:6-15
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Rao Shuaichao^ORCID,Zou Xingli^ORCID,Wang Shujuan,Lu Yi,Shi Tianyu,Hsu Hsien-Yi,Xu Qian,Lu Xionggang

Funder

National Natural Science Foundation of China

Iron and Steel Joint Research Found of National Natural Science Foundation

China Baowu Steel Group Corporation Limited

Shanghai Rising-Star Program

CAS Interdisciplinary Innovation Team

Strategic Research Grant

SZSTI Grant

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference44 articles.

1. Structure, microstructure and corrosion properties of brush-plated Cu–Ni alloy;Rajasekaran;J. Appl. Electrochem.,2009

2. Magnetoresistance and structural study of electrodeposited Ni-Cu/Cu multilayers;Fesharaki;J. Electrochem. Soc.,2012

3. The corrosion behavior of sintering micro-porous Ni–Cu alloy in hydrofluoric acid solution;Yu;J. Alloy. Comp.,2015

4. Improved pitting corrosion behaviour of electrodeposited nanocrystalline Ni–Cu alloys in 3.0 wt.% NaCl solution;Ghosh;J. Alloy. Comp.,2006

5. Hydrogen evolution assisted electrodeposition of porous Cu-Ni alloy electrodes and their use for nitrate reduction in alkali;Mattarozzi;Electrochim. Acta,2014

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