Author:
Emery Samuel B.,Hubbley Jennifer L.,Darling Maria A.,Roy Dipankar
Subject
Condensed Matter Physics,General Materials Science
Reference50 articles.
1. Chemical–Mechanical Polishing 2001: Advances and Future Challenges,2001
2. Copper Interconnects, New Contact Metallurgies, and Low-k Interlevel Dielectrics, ECS Symposium Proceedings;Li,2000
3. Evaluation of diffusion barrier and electrical properties of tantalum oxynitride thin films for silver metallization
4. Chemical mechanical polishing of silver damascene structures
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献