Author:
Zhang Qiang,Wu Gaohui,Jiang Longtao,Chen Guoqin
Subject
Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Electronic systems packaging: future reliability challenges;Barrett;Microelectron. Reliab.,1998
2. Future trends in materials for lightweight microwave packaging;David;Microelectron. Int.,1998
3. Thermal management materials and design;Robins;Electron. Packag. Prod.,2000
4. Advances in composite materials for thermal management in electronic packaging;Zweben;JOM,1998
5. Low-expansion MMCs boost avionics;Geiger;Adv. Mater. Process,1989
Cited by
78 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献