Effect of surface treatment on wafer direct bonding process-Reference-Cited by-同舟云学术

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Effect of surface treatment on wafer direct bonding process

Published:2004-02 Issue:2-3 Volume:83 Page:265-272
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Lai Shin-I,Lin Hung-Yi,Hu Chen-Ti

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference24 articles.

1. D.M. Kenney, US Patent 3332137 (1967).

2. J. Riseman, US Patent 4169000 (1979).

3. T. Nakamura, US Patent 3239908 (1964).

4. Wafer bonding for silicon‐on‐insulator technologies

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